TGV(Through Glass Via) Process
- High Aspect Ratio
- 다양한 Taper Angle 생성 가능
- 시간당 100,000Holes 가공 능력
- No Crack Generation
Aspect ratio : 30 :1 (Quartz)
![](../images/user_img/m_2_2_img0.jpg)
Taper Angel : 90˚
![](../images/user_img/m_2_2_img2.jpg)
최소 pitch 가공
![](../images/user_img/m_2_2_img1.jpg)
cavity 가공
![](../images/user_img/m_2_2_img3.jpg)
가공홀 측정 data
Borosilicate & Sodalime & etc.
Fine Pitch Process (Min. 10㎛)
Hole Size : 100㎛ @ 1t
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